CopperBond® Extra Thin Foil (XTF)
CopperBond® XTF is an extra thin releasable (peelable) foil on a thicker carrier foil. Its thickness can be customized to meet your applications requirements. It is currently available at any thickness between 1 and 5 microns. The extra thin ED Foil is carried by a releasable 1-ounce (35 micron) copper foil utilizing an inorganic release layer which provides exceptionally consistent release force even when laminated at elevated temperatures.
As electronics products become smaller, faster and more complex, the demand for high-density interconnect (HDI) printed circuit boards continues to rise. HDI requirements such as finer features, controlled geometry, fewer layers, and simplified wiring are possible with this innovative solution. CopperBond XTF gives forward-thinking designers the tools necessary to use HDI technology to its full capacity. It is being embraced as the next generation of thin.
XTF Advantages
- Finer Features
- Fewer Defects
- Higher Yields
Foil Thickness
Foil Width
- 0.032” to 27” (0.8 to 685mm)