CopperBond® Extra Thin Foil (XTF)
CopperBond® XTF thickness can be customized to meet your applications requirements and is currently available between 1 and 5 microns in increments of 0.5 micron. The ED Foil is carried by a releasable 1-ounce copper foil utilizing an inorganic release layer which provides exceptionally consistent release force even when laminated at elevated temperatures.
As electronics products become smaller, faster and more complex, the demand for high-density interconnect (HDI) printed circuit boards continues to rise. HDI requirements such as finer features, controlled geometry, fewer layers, and simplified wiring are possible with this innovative solution. CopperBond XTF give forward thinking designers the tools necessary to use HDI technology to its full capacity. It is being embraced as the, next generation of thin.
XTF Advantages
- Finer Features
- Lower Defects
- Higher Yields
ED Foil Thickness
- 1 micron
- 3 micron
- 5 micron
Width
- 0.032” to 27” (0.8 to 685mm)