CopperBond
The growth of the flexible printed circuit industry has stimulated Somers’ own technology resulting in precision rolled copper foil meeting the highest standards. This led to the development of our CopperBond® dendritic surface treatment which provides a tightly adhering, uniform, electrochemical deposition of pure copper dendrites on the foil surface. Bond strength is increased several times over that of smooth copper, depending upon the adhesive/substrate system utilized. The mechanism providing the higher bond strength is primarily mechanical in nature, and treatment is designed to give a controlled, irregular topography. This irregularity allows a hooking action to occur between the copper, adhesive, and substrate, generating high mechanical peel strengths.
The three different products offered by Somers can be applied to precision rolled foils. One Side CopperBond® treated foil, CopperBond DT ™ (double-treated), and CopperBond Black™, a low profile copper-nickel treatment. Increased miniaturization has driven Somers to introduced alloy B52, and high strength and conductivity alloy, rolled to 0.00047” (12µm) thick and CopperBond® treated to continue our support of the of the demanding electronics industry.
Alloys Typically Treated
- C110, C7025, & B52
(Inquire regarding other alloys)
Thickness
- 1/3 oz to 6 oz
(0.00047” to 0.0083”)
(12µm to 0.21mm)
Width
- 0.032” to 27” Wide
(0.8mm to 685mm)