CopperBond Treated Copper Foil
The growth of the flexible printed circuit and battery industries has stimulated Somers’ own technology resulting in precision rolled copper (RA) foil meeting the highest standards. This led to the development of our CopperBond® dendritic surface treatment which provides a tightly adhering, uniform, electrochemical deposition of copper or copper-nickel dendrites on the foil surface. Bond strength is increased significantly over that of smooth copper, depending upon the adhesive/substrate system utilized. The mechanism providing the higher bond strength is primarily mechanical in nature, and treatment is designed to give a controlled, irregular topography. This irregularity allows a hooking action to occur between the copper, adhesive, and substrate, generating high mechanical peel strengths.
Multiple types of surface treatment are available on the rolled foils - CopperBond® Pink treatment, CopperBond DT™ (double-side-treatment), CopperBond Black™ (a low profile copper-nickel treatment) and nickel-plating. Increased miniaturization and performance demands have also driven Somers to introduce copper alloy foils, with higher strengths and different properties versus pure copper foils, rolled to as thin as 0.00039” (10 µm) thickness, and with or without surface treatment.
Alloys Typically Treated
- C110, C151, C194, C195 & C7025
(Inquire regarding other alloys)
Thickness
- < 1/3 oz to > 6 oz
(0.00039” to 0.0083”)
(10 µm to 0.21 mm)
Width
- 0.032” to 27” Wide
(0.8 mm to 685 mm)